cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 1/6 DAN217S6R c y s t ek product s pecification high ?speed multi-chip diode DAN217S6R description the DAN217S6R consists of two set of high-speed sw itching diodes connected in series, fabricated in planar technology, and encapsulated in the small sot-363 plastic smd package. equivalent circuit outline features ? small plastic smd package ? high switching speed: max. 4ns ? continuous reverse voltage: max. 75v ? repetitive peak reverse voltage: max. 85v ? repetitive peak forward current: max. 450ma . ? very low leakage current ? pb-free package applications ? high-speed switching in thick and thin-film circuits. sot-363 DAN217S6R 1 anode 2 cathode http://
cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 2/6 DAN217S6R c y s t ek product s pecification absolute maximum ratings, per diode @t a =25 parameters symbol min max unit repetitive peak reverse voltage v rrm - 85 v continuous reverse voltage v r - 85 v continuous forward current i f - 160 ma non-repetitive peak forward current @square wave, tj=125 prior to surge t=1 s t=10ms t=1s i fsm - - - 4 1 0.5 a a a total power dissipation ( note 1 ) ptot 200 mw total power dissipation ( note 2 ) ptot 300 mw junction temperature t j - 150 c storage temperature t stg -65 +150 c electrical characteristics, per diode @ tj=25 unless otherwise specified parameters symbol conditions min typ. max unit reverse breakdown voltage v( br)r i r =100 a 85 - - v forward voltage v f i f =1ma i f =10ma i f =50ma i f =150ma - - 0.9 1 1.1 1.25 v v v v reverse current i r v r =75v - - 5 na diode capacitance c d v r =0v, f=1mhz - 2 - pf reverse recovery time trr when switched from i f =10ma to i r =10ma,r l =100 ? , measured at i r =1ma - - 4 ns thermal characteristics symbol parameter conditions value unit rth,j-a thermal resistance from junction to ambient note 1 625 /w rth,j-a thermal resistance from junction to ambient note 2 417 /w note : 1. device mounted on a fr-4 pcb with copper area of 1 inch 0.82 inch and thickness 0.062 inch . 2 . devi c e m ount ed o n a al um i n a pc b wi t h a r ea of 0. 4 i n c h 0 . 3 i nch an d th ickn ess 0.024 in ch . ordering information device package shipping marking DAN217S6R sot-363 (pb-free) 3000 pcs / tape & reel k52
cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 3/6 DAN217S6R c y s t ek product s pecification characteristic curves p o w e r d e ra t i ng c urve 0 50 100 150 200 250 0 25 5 0 75 1 00 125 150 a m b i e n t t e mpe ra t u re ---t a ( ) p o w e r d i s s i p a t i o n ---p d (mw ) see note 1 on page 1 per package f o rw a r d c u rre nt v s f o rw a r d v o l t a g e 0.1 1 10 10 0 10 00 0. 2 0. 4 0. 6 0 . 8 1 1 . 2 f o r w ar d v o l t ag e- - - v f (v ) f o rw a r d c u rre n t ---i f (ma ) ta= - 40 ta= 2 5 ta=8 5 per element r ev er s e le ak ag e c u r r en t v s r ev er s e v o lt ag e 0.001 0. 01 0. 1 1 10 10 0 0 1 02 0 3 0 4 05 0 r ev e r s e v o l t ag e - - - v r (v ) r ev e r s e l e ak a g e c u r r en t - - - i r( a ) t a = 1 2 5 t a = 25 t a = 15 0 ta=55 ta=85 per element c a p a c i ta n c e v s r ev er s e v o l tag e 0.4 0. 44 0. 48 0. 52 0. 56 0. 6 0. 64 0. 68 02 46 8 1 0 1 2 1 4 1 6 r e v er s e v o l t ag e- - - v r (v ) d i o d e c a p a c i t a n c e ---c d (p f ) f=1mhz ta=25 per element
cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 4/6 DAN217S6R c y s t ek product s pecification reel dimension carrier tape dimension
cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 5/6 DAN217S6R c y s t ek product s pecification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cys tech electronics corp. s pec. no. : c328 s6 issued date : 20 09.1 1.23 revised date : page no. : 6/6 DAN217S6R c y s t ek product s pecification sot-363 dimension marking: 6-l ead sot - 363 r plasti c surface mou n ted packa g e cys t ek pa ckage code: s6 r st y l e : pin 1. anode 1 (a1) pin 2. cathod e1 (c1) pin 3. anode/ catho de 2 (a c2 ) pin 4. anode 2 (a2) pin 5. cathod e2 (c2) pin 6. anode/ catho de 1 (a c1 ) device code k 5 2 millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 0.900 1.100 0.035 0.043 e1 2.150 2.450 0.085 0.096 a1 0.000 0.100 0.000 0.004 e 0.650 typ 0.026 typ a2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055 b 0.150 0.350 0.006 0.014 l 0.525 ref 0.021 ref c 0.080 0.150 0.003 0.006 l1 0.260 0.460 0.010 0.018 d 2.000 2.200 0.079 0.087 0 8 0 8 e 1.150 1.350 0.045 0.053 notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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